Semi-automatic prober compatible with microcurrent measurement and high-power measurement! It supports wafer sizes up to 8 and 12 inches, respectively.
-60℃ to +350℃ temperature characteristic evaluation, microcurrent measurement
Compatible with power device measurements over 20kV and 200A
◎ A compact shield mechanism that can replace dry air prevents condensation even at negative temperatures.
◎ The compact shielding effect enables stable microcurrent measurements.
◎ The control software is user-friendly and excels in operability for operators.
◎ It can be equipped with automatic wafer alignment and automatic individual chip alignment utilizing image recognition.
◎ The control software is designed with icons arranged in process order to prevent operators from getting lost during operation, enhancing usability.
◎ It has a wafer alignment function that allows for angle adjustment and fine-tuning of XY positions using a model.
◎ After registering the die origin position, it features automatic detection of characteristic patterns through image processing, registering them as reference models.
◎ It is also possible to automatically align registered individual chips placed in a registered tray using image recognition. (Optional)
◎ It can be equipped with auto XYZ to accommodate wafer expansion, etc. (Optional)
- Company:アポロウエーブ 本社
- Price:10 million yen-50 million yen